Rikkert Engels (Xillio) became the 2018 “Localization process innovator of the year USA” at the Localization World event in Seattle.

Their innovation entitled “Localization Needs an Updated Connector Strategy” discussed a content integration platform (layer) as a way to solve to the content connectivity challenge. Rikkert argued that having one single connectivity API enables real continuous localization, standardization and scale for content localization.

Runner-up was Patrícia Paladini Adell (CA Technologies) pitching “Shift Left on Internationalization Readiness”. Patrícia visually showed the audience how CA technologies was able to more left in their I18N strategy, making asynchronous internationalization/localization more of a reality. In the process she showed some impressive benefits and results. Second runner-up Dalibor Frívaldský (Memsource) showed AI efficiency tools in the MT life-cycle bringing measurable and tangible benefits.

The result (live voted by the PIC audience) was close to call, with just 8 percentage points separating first and third places.
As event Moderator Jeff Kiser (Xplanation) put it; “The bar has gone up again, for the level of innovation as well as the quality of the pitches.”

6 innovators were shortlisted to pitch their innovation on stage at locWorld in Seattle:

  • Konstantine Boukhvalov (Experis-ManpowerGroup)
  • Konstantin Savenkov (Intento, Inc.)
  • Vincent Swan (Pactera Technologies)
  • Rikkert Engels (Xillio)
  • Dalibor Frívaldský (Memsource)
  • Patrícia Paladini Adell (CA Technologies)

Congratulations to all innovators and thanks to all those who sent in proposals.

This 5th PIC event closes out a second successful year for the PIC event at LocWorld. Work has already begun to develop the scope of the platform and move the bar higher while reaching more innovators and parties interested in innovation during 2019.

Do you have a Process or technology innovation for the PIC “stage”?
If so, get in contact with us and keep an eye on our twitter feed @LionPIC for the next call for papers.